Micro announces UFS 2.1 3D NAND mobile storage chip

133

Micron has introduced a new 3D NAND chip for mobile gadgets, saying it will give your smartphones a lot more storage capability and possibly even decrease the use of SD playing cards.

The memory technological know-how, dependent on the Universal Flash Storage (UFS) two.1 typical, will appear at very first as a 32GB solution. The business guarantees its module will supply users seamless High definition movie streaming, greater bandwidth gameplay and faster boot up time.

“Micron carries on to progress NAND technological know-how with our introduction of 3D NAND and UFS products and solutions for the mobile section”, says Mike Rayfield, vice president of Micron’s mobile organization unit. “The improved functionality, greater capability and improved reliability of 3D NAND will help our buyers meet the at any time-expanding desire for mobile storage and will permit much a lot more interesting conclusion user ordeals”.

The new module features 3 moments a lot more capability than the prior generation planar NAND technologies, largely for the reason that it is able of stacking levels of info storage cells vertically, with “remarkable precision”. This vertical stacking lets it to use less place, which is why it says this memory module is the industry’s smallest, measuring at sixty.217mm2.

“3D NAND technological know-how will be very important to the ongoing improvement of smartphones and other mobile gadgets”, says Greg Wong, founder and principal analyst at Forward Insights. “With the arrival of 5G and mobile’s expanding influence in our electronic life, smartphone makers are in will need of the most advanced technological know-how to shop and control the at any time-expanding quantity of info. Micron’s 3D NAND for mobile is properly suited to address the market’s evolving info storage wants by enabling a a lot more seamless user encounter for significant resolution movie, gaming, and photography”.

Revealed beneath license from ITProPortal.com, a Web Communities Ltd Publication. All legal rights reserved.

Resource